Module structure
AssigneeShanghai Harvest Intelligence Technology Co., Ltd.
InventorsJiandong HUANG, Fengjun GU
Life of this patent
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AssigneeShanghai Harvest Intelligence Technology Co., Ltd.
InventorsJiandong HUANG, Fengjun GU
Estimating the term…
The present disclosure provides a module structure, including: a middle frame having a first surface, wherein a groove is disposed in the middle frame and has an opening on the first surface; a sensing module, wherein at least a partial of the sensing module is disposed in the groove; a display unit, disposed on the first surface of the middle frame and the sensing module; a first dielectric layer disposed between the sensing module and the display unit; a second dielectric layer disposed between the sensing module and a bottom of the groove; and a third dielectric layer disposed between the first surface of the middle frame and the display unit. With the first dielectric layer, when any one of the sensing module or the display unit is damaged in a testing process, the other one can be recovered, thereby reducing the cost and loss.
A module structure, comprising:
Dependencies are inferred from the claim text.