Substrate processing method, storage medium, and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsYusaku HASHIMOTO, Kouichirou TANAKA, Masahiro FUKUDA, Atsushi OOKOUCHI
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AssigneeTokyo Electron Limited
InventorsYusaku HASHIMOTO, Kouichirou TANAKA, Masahiro FUKUDA, Atsushi OOKOUCHI
Estimating the term…
A method of processing a substrate includes: performing a first developing process of moving a nozzle having one end surface and a discharge port opened at the end surface while making the end surface come into contact with a developer on a front surface of a substrate in a state in which the nozzle is disposed so that the end surface faces the front surface and the developer is discharged from the discharge port at a first flow rate while rotating the substrate; and after the first developing process, performing a second developing process of discharging the developer from the discharge port at a second flow rate higher than the first flow rate in a state in which the end surface is in contact with the developer on the front surface at a position facing a center of the front surface of the substrate while rotating the substrate.
A method of processing a substrate, the method comprising:
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.