Method for producing plated formed product

2:

• The method for producing a plated formed product according to claim 1, wherein the photosensitive resin composition further contains polymer (A) having an acid dissociative group and photoacid generator (B).

3:

• The method for producing a plated formed product according to claim 2, wherein a content of the sulfur-containing compound is 0.2 to 2.0 parts by mass, with respect to 100 parts by mass of a polymer component including polymer (A) having an acid dissociative group included in the photosensitive resin composition.

4:

• The method for producing a plated formed product according to claim 1, wherein the resist pattern film has a thickness of 1 to 100 μm.

5:

• The method for producing a plated formed product according to claim 1, wherein the metal film is a copper film.

6:

• The method for producing a plated formed product according to claim 1, wherein the plating treatment is a copper plating treatment.

7:

• The method for producing a plated formed product according to claim 1, comprising a step of washing a substrate having a plasma-treated resist pattern film on a metal film with an acid before the step (5).

8:

• The method for producing a plated formed product according to claim 1, comprising a step of washing a substrate having a plasma-treated resist pattern film on a metal film with an aqueous solution of potassium permanganate or an aqueous solution of sulfuric acid before the step (5).