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US 2022/0035238 A1Published application
Photolithography alignment method and system
AssigneeChangxin Memory Technologies, Inc.
InventorLei ZHAO
Life of this patent
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Abstract
A photolithography alignment method includes: performing alignment measurement of a surface condition of a wafer to obtain alignment information of the wafer; and sectioning the wafer into a plurality of areas to be processed according to the alignment information, and determining photolithography alignment parameters corresponding to each area to be processed.
Claims20
A photolithography alignment method, comprising:
- performing alignment measurement of a surface condition of a wafer to obtain alignment information of the wafer;
- and
- sectioning the wafer into a plurality of areas to be processed according to the alignment information, and determining photolithography alignment parameters corresponding to each area to be processed.
A photolithography alignment system, comprising:
- a measurement component, configured to perform alignment measurement of a surface condition of a wafer to obtain alignment information of the wafer;
- and
- a processing component, configured to section the wafer into a plurality of areas to be processed according to the alignment information, and determine photolithography alignment parameters corresponding to each area to be processed.
Dependencies are inferred from the claim text.