Gas supply unit and substrate processing apparatus including the gas supply unit

A substrate processing apparatus, comprising:

• a partition configured to provide a gas supply channel;
• and
• a gas supply unit connected to the gas supply channel,
• wherein a gas flow channel communicating with the gas supply channel is formed in the gas supply unit,
• wherein a first through-hole is formed to penetrate through at least a part of the partition, a second through-hole is formed to penetrate through at least a part of the gas supply unit, and the first through-hole communicates with the gas flow channel via the second through-hole,
• wherein the second through-hole is arranged between a center and an edge of the gas flow channel, and is arranged spaced apart from the edge,
• wherein the gas supply channel is coupled to the first through-hole via the gas flow channel, and
• wherein the gas flow channel has a width gradually decreasing from the center of the gas supply unit toward a periphery of the gas supply unit.

A substrate processing apparatus, comprising:

• a partition configured to provide a gas supply channel;
• and
• a gas supply unit connected to the gas supply channel,
• wherein a gas flow channel communicating with the gas supply channel is formed in the gas supply unit,
• wherein a first through-hole is formed to penetrate through at least a part of the partition, a second through-hole is formed to penetrate through at least a part of the gas supply unit, and the first through-hole communicates with the gas flow channel via the second through-hole,
• wherein the gas flow channel has a width gradually decreasing from the center of the gas supply unit toward a periphery of the gas supply unit.