Cleaning liquid composition
AssigneeKanto Kagaku Kabushiki Kaisha
InventorAreji TAKANAKA
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Abstract
An object of the present invention is to provide a cleaning liquid that effectively removes in a short time organic residues and abrasive grains derived from a slurry in a semiconductor substrate in which a Co contact plug and/or Co wiring are present. The present invention relates to a cleaning liquid composition for cleaning a substrate having a Co contact plug and/or Co wiring, which contains one or more reducing agents and water. Furthermore, the present invention relates to a cleaning liquid composition for cleaning a substrate having Co and not having Cu, which contains one or more reducing agents and water and has a pH of 3 or more and less than 12.
Claims10
A cleaning liquid composition for cleaning a substrate, the cleaning liquid composition containing one or more reducing agents and water, wherein:
- (a) the substrate has Co contact plug and/or Co wiring, or
- (b) the substrate has Co and does not have Cu, and a pH of the cleaning liquid composition is 3 or more and less than 12.
(canceled)
Dependencies are inferred from the claim text.