Polishing liquid
AssigneeDisco Corporation
InventorsAyumu SAKAI, Norihisa ARIFUKU, Takeshi SATO
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Abstract
Provided is a polishing liquid that is used when one surface of a wafer is polished by use of a fixed abrasive grain polishing pad with abrasive grains fixed in the pad, in which an organic salt that exhibits a basic property by hydrolysis and contains no metal and an organic base that contains no metal are dissolved, and no abrasive grains are contained. Preferably, the organic salt includes a strong basic cation and a weak acidic anion, and the organic base contains at least one of ammonia, an amine, and a basic amino acid.
Claims3
A polishing liquid that is used when one surface of a wafer is polished by use of a fixed abrasive grain polishing pad with abrasive grains fixed in the pad,
- wherein an organic salt that exhibits a basic property by hydrolysis and contains no metal and an organic base that contains no metal are dissolved, and no abrasive grains are contained.
Dependencies are inferred from the claim text.