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US 2022/0033664 A1Published application
Molding composition and method for manufacturing three-dimensional shaped object
AssigneeSeiko Epson Corporation
InventorsKozo SHITAGAMI, Eiji OKAMOTO, Akihiko TSUNOYA
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Abstract
A molding composition contains a powder, a wax, an adhesive component, a molding component, and a plasticizer, in which a melt flow rate of the adhesive component at 190° C. is 200 g/10 min or more, and a density of the plasticizer is 1.0 g/cm3 or less.
Claims5
A molding composition comprising:
- a powder;
- a wax;
- an adhesive component;
- a molding component;
- and
- a plasticizer, wherein
- a melt flow rate of the adhesive component at 190° C. is 200 g/10 min or more, and
- a density of the plasticizer is 1.0 g/cm3 or less.
5 more elements
Dependencies are inferred from the claim text.