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US 2022/0033597 A1Published application
Thick polyimide film having improved surface quality and method of manufacturing same
AssigneePI Advanced Materials Co., Ltd.
InventorsWon Ho SON, Hyong Sop JO
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Abstract
The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.
Claims17
A polyimide film manufactured by imidizing a polyamic acid solution, wherein a following parameter A falls within a range from 0.4 to 1.13:
- A=log((V·Mn)2·√{square root over (T)})−21
- wherein V is a viscosity of the polyamic acid solution and is 200,000 cP to 250,000 cP as measured at 23° C. when a solid content thereof is 18.5 wt %, Mn is a number average molecular weight of polyamic acid dissolved in the polyamic acid solution and is 100,000 g/mole to 150,000 g/mole, and T is a thickness of the polyimide film and is 55 μm to 110 μm.
A method of manufacturing a polyimide film, comprising:
- (a) preparing a polyamic acid solution by polymerizing a dianhydride monomer comprising at least one component and a diamine monomer comprising at least one component in an organic solvent;
- and
- (b) imidizing the polyamic acid solution to obtain a polyimide film,
- wherein a following parameter A falls within a range from 0.4 to 1.13:
- A=log((V·Mn)2·√{square root over (T)})−21
- wherein V is a viscosity of the polyamic acid solution and is 200,000 cP to 250,000 cP as measured at 23° C. when a solid content thereof is 18.5 wt %, Mn is a number average molecular weight of polyamic acid dissolved in the polyamic acid solution and is 100,000 g/mole to 150,000 g/mole, and T is a thickness of the polyimide film and is 50 μm to 110 μm.
3 more elements
Dependencies are inferred from the claim text.