Cutting method and cutting machine table for cutting substrate

A cutting method for cutting a substrate, comprising steps of:

• placing a large substrate to be cut on a first cutting machine table and a second cutting machine table of a cutting machine table;
• adjusting a cutting apparatus to a cutting position of the substrate to be cut corresponding to the position between the first cutting machine table and the second cutting machine table;
• driving a Z-axis screw rod by a drive module to lift an end of the second cutting machine table close to the first cutting machine table according to a first angle parameter to enable a cutting inclination angle to be formed between the second cutting machine table and the first cutting machine table;
• cutting the large substrate to be cut to obtain a finished substrate falling on the second cutting machine table;
• driving the Z-axis screw rod by the drive module to lift the end of the second cutting machine table close to the first cutting machine table according to a second angle parameter after the cutting, so that a splitting inclination angle is formed between the second cutting machine table and the first cutting machine table to split the substrates;
• obtaining a split finished substrate falling on the second cutting machine table after the splitting;
• driving the Z-axis screw rod by a drive module to lift the end of the second cutting machine table close to the first cutting machine table according to a third angle parameter to enable a driving-away inclination angle to be formed between the second cutting machine table and the first cutting machine table;
• and
• transferring the finished substrate obtained by cutting to a specified position with a grabbing apparatus, and resetting the second cutting machine table to an initial state by the cutting machine table.

A cutting machine table, comprising:

• a first cutting machine table;
• a second cutting machine table aligned with the first cutting machine table, wherein the first cutting machine table and the second cutting machine table are configured for supporting a substrate to be cut, and in an initial state, the second cutting machine table is horizontally aligned with the first cutting machine table;
• a driving apparatus comprising a Z-axis screw rod and a drive module, wherein the Z-axis screw rod is arranged below an end of the second cutting machine table close to the first cutting machine table, and the drive module drives the Z-axis screw rod to adjust the height of the end of the second cutting machine table close to the first cutting machine table;
• a cutting apparatus configured for cutting the large substrate to be cut to obtain a finished substrate;
• and
• a grabbing apparatus configured for transferring the finished substrate obtained by cutting to a specified position.