Mems package with shock and vibration protection
AssigneeBeijing Voyager Technology Co., Ltd.
InventorsYoumin Wang, Anan Pan, Henghui Jiang
Life of this patent
Estimating the term…
Abstract
An optical micro-electromechanical system (MEMS) system is disclosed. The optical MEMS system includes a printed circuit board (PCB), and a MEMS optical integrated circuit (IC) package mounted to the PCB. The IC package includes a MEMS optical die, and a plurality of leads electrically and mechanically connected to the MEMS optical die and to the PCB. The optical MEMS system also includes one or more elastomeric grommets contacting one or more of the leads, where the grommets are configured to absorb mechanical vibration energy from the contacted leads.
Claims20
An optical micro-electromechanical system (MEMS) system, comprising:
- a printed circuit board (PCB);
- a MEMS optical integrated circuit (IC) package mounted to the PCB, the IC package comprising:
- a MEMS optical die, and
- a plurality of leads electrically and mechanically connected to the MEMS optical die and to the PCB;
- one or more elastomeric grommets contacting one or more of the leads, wherein the grommets are configured to absorb mechanical vibration energy from the contacted leads.
A LiDAR system, comprising:
- a pulsed light source, comprising:
- a printed circuit board (PCB);
- a MEMS integrated circuit (IC) package mounted to the PCB, the IC package comprising:
- a MEMS optical die sensitive to mechanical vibration and configured to provide pulsed light, and
- a plurality of leads electrically and mechanically connected to the PCB;
- one or more elastomeric grommets contacting one or more of the leads, wherein the grommets are configured to absorb mechanical vibration energy from the contacted leads;
- a light detector configured to detect light from the pulsed light source.
A method of manufacturing an optical micro-electromechanical system (MEMS) system, comprising:
- placing a MEMS optical integrated circuit (IC) package on a printed circuit board (PCB), the IC package comprising:
- a MEMS optical die, and
- a plurality of leads electrically and mechanically connected to the MEMS optical die,
- placing one or more elastomeric grommets on the PCB;
- and
- causing the grommets to contact one or more of the leads, wherein the grommets are configured to absorb mechanical vibration energy from the contacted leads.
Dependencies are inferred from the claim text.