Sensor package including a substrate with an inductor layer

A sensor package comprising:

• a printed circuit board including at least four layers, the at least four layers including a bottom layer and a top layer opposite the bottom layer, the printed circuit board including a sound port comprising an aperture running through all four layers of the printed circuit board;
• a microelectromechanical systems transducer mounted on the top layer of the printed circuit board, the microelectromechanical systems transducer comprising a diaphragm and a back plate, the diaphragm acoustically coupled to the sound port;
• and
• an inductor coupled to the microelectromechanical systems transducer, where the inductor is configured as a single layer trace on an inductor layer within the printed circuit board, the inductor layer being one of the at least four layers, the inductor layer comprising a layer closer to the bottom layer than the top layer of the at least four layers.