Liquid ejection head and manufacturing method thereof

Abstract

Provided is a manufacturing method of a liquid ejection head, and the manufacturing method includes steps of: providing an ejection orifice forming member on one surface of a wafer, in which an energy-generating element is provided on the one surface of the wafer; forming a recess on the other surface of the wafer; and dicing the wafer along a plurality of dicing lines. The plurality of dicing lines include a dicing line extending in one direction and a dicing line extending in a direction crossing the one direction, and the recess is formed on each of positions overlapping the dicing lines except for an intersection part where the dicing line extending in the one direction intersects the dicing line extending in the direction crossing the one direction.

Dependencies are inferred from the claim text.