Back to results
US 2022/0032582 A1Published application
Structure and exterior housing
AssigneesSony Group Corporation, Tohoku University
InventorsYuichi TAKAHASHI, Gen YONEZAWA, Shohei ABE, Takehito SHIMATSU, Miyuki UOMOTO
Life of this patent
Estimating the term…
Abstract
A structure according to an embodiment of the present disclosure includes: a first substrate; a second substrate opposed to the first substrate; a bonding layer provided between the first substrate and the second substrate; and a first decorative layer provided between the first substrate and the second substrate.
Claims16
A structure comprising:
- a first substrate;
- a second substrate opposed to the first substrate;
- a bonding layer provided between the first substrate and the second substrate;
- and
- a first decorative layer provided between the first substrate and the second substrate.
2 more elements
An exterior housing comprising a structure, the structure including
- a first substrate,
- a second substrate opposed to the first substrate,
- a bonding layer provided between the first substrate and the second substrate, and
- a first decorative layer provided between the first substrate and the second substrate.
1 more element
Dependencies are inferred from the claim text.