Molding method and molding system
AssigneeThe Japan Steel Works, Ltd.
InventorsTakayuki HIRANO, Kazuma HAMADA, Kenichi FURUKI
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Abstract
A molding method integrally molds thermoplastic resin and a flexible substrate mounted with a circuit and an electronic component on a flat plate having flexibility into a three-dimensional shape. The molding method includes the steps of determining an unfolded shape and circuit arrangement of the flexible substrate corresponding to the three-dimensional shape, elastically deforming and holding the flexible substrate along a resin filling space of a mold while the mold is being opened, and closing the mold and filling the resin filling space with thermoplastic resin.
Claims11
A molding method of integrally molding thermoplastic resin and a flexible substrate mounted with a circuit and an electronic component on a flat plate having flexibility to form a three-dimensional shape, the molding method comprising the steps of:
- (a) preparing the flexible substrate having an unfolded shape and circuit arrangement corresponding to the three-dimensional shape;
- (b) elastically deforming the flexible substrate, into the three-dimensional shape, and holding the flexible substrate along a mold while the mold is being opened;
- and
- (c) closing the mold and filling a resin filling space of the mold with thermoplastic resin.
A molding system configured to integrally mold thermoplastic resin and a flexible substrate mounted with a circuit and an electronic component on a flat plate having flexibility to form a three-dimensional shape, the molding system comprising:
- a substrate holding device configured to elastically deform the flexible substrate, into the three-dimensional shape, and hold the flexible substrate along a resin filling space of a mold while the mold is being opened;
- and
- an injection molding apparatus configured to close the mold and fill the resin filling space with thermoplastic resin.
Dependencies are inferred from the claim text.