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US 2022/0032406 A1Published application
Solder alloy
AssigneeSenju Metal Industry Co., Ltd.
InventorsYuuki IIJIMA, Shunsaku YOSHIKAWA, Takashi SAITO
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Abstract
A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.
Claims8
A solder alloy having an alloy composition consisting of, in mass %, Ag:
- 0 to 4%, Cu:
- 0.1 to 1.0%, Ni:
- 0.01 to 0.3%, Sb:
- 5.1 to 7.5%, Bi:
- 0.1 to 4.5%, Co:
- 0.001 to 0.3%, P:
- 0.001 to 0.2%, and a balance being Sn.
4 more elements
Dependencies are inferred from the claim text.