US 2022/0032402 A1 · Methods and systems for machining precision micro holes into thick ceramic substrates

Abstract

A combination of a liquid jet and a mechanical rotary tool can be used to machine precision micro holes in thick substrates. A liquid-jet guided laser can be used to rapidly drill core holes into the ceramic substrate. A sensor can be applied to detect the cut through point of the liquid-jet guided laser drilling step to allow a rapid and closed-loop controlled machining process. The substrate can be heated up for speeding up a liquid-jet guided laser drilling process. A mechanical tool such as a drill, a reamer or a mill can be applied to finish the core holes to a desired bore diameter. The mechanical tool cutting main surface can preferably consist of a diamond material. An inspection camera and illumination system can be applied to inspect each mechanically finished bore as part of the drilling process.

Claims20

Dependent claims

A method comprising

forming a hole in a substrate using a liquid-jet guided laser beam,
wherein the liquid-jet guided laser beam comprises a laser beam internally reflected within a column of liquid,
wherein the column of liquid is formed by flowing the liquid through a nozzle,
wherein the internally reflected laser beam is formed by focusing a laser beam into the column of liquid;
smoothing the hole using a mechanical rotary tool to achieve a final dimension,
wherein the mechanical rotary tool is operated by a mechanical rotating system,
wherein the mechanical rotary tool comprises a diameter suitable for the final dimension of the hole.

4 more elements

Dependencies are inferred from the claim text.

Methods and systems for machining precision micro holes into thick ceramic substrates

Life of this patent

Methods and systems for machining precision micro holes into thick ceramic substrates

Life of this patent

Abstract

Claims20