Array substrate, manufacturing method thereof, and display device

A method of manufacturing an array substrate, comprising:

• forming a plurality of array areas on a base substrate to obtain a backplane, each of the array areas comprising a display area and a non-display area, the non-display area being provided with a peripheral circuit therein, the peripheral circuit comprising a test area, a bonding area, and a cutting area, the test area being provided with a test signal line therein configured to provide a test signal, the bonding area being adjacent to the display area, the bonding area and the test area being electrically connected through signal leads, and the cutting area being disposed between the test area and the bonding area;
• dividing the backplane into a plurality of the array substrates;
• in a test phase, providing a test signal through the test area, the test area providing the test signal to the display area through the bonding area to test the display area;
• and
• after the test is completed, cutting the signal leads in the cutting area by a laser, and forming a cutting opening on each of the signal leads to disconnect a connection between the test area and the bonding area, wherein a position of a cut opening of at least one signal lead is different from positions of cut openings of other signal leads in height along the extending direction of the signal leads.