Heat dissipation in semiconductor packages and methods of forming same

A semiconductor package comprises:

• a first package component comprising:
• a first semiconductor die comprising a first semiconductor substrate;
• a first encapsulant around the first semiconductor die;
• and
• a first redistribution structure electrically connected to the semiconductor die;
• a second package component bonded to the first package component, wherein the second package component comprises a second semiconductor die on a second semiconductor substrate, and wherein the first semiconductor substrate is directly attached to the second semiconductor substrate by a film;
• and
• a second encapsulant between the first package component and the second package component.

A method comprising:

• forming a redistribution structure, wherein the redistribution structure comprises a first contact pad and a second contact pad in an insulating layer;
• forming a through via on the second contact pad;
• bonding a first die to the redistribution structure, wherein a dielectric layer of the first die contacts the insulating layer, and wherein a third contact pad of the first die contacts the first contact pad;
• attaching a heat spreader to a surface of the first die opposite the redistribution structure;
• and
• bonding a package component comprising a second die to the through via, wherein the heat spreader is between the first die and the package component.