Double-sided integrated circuit module having an exposed semiconductor die

A method for assembling a radio frequency (RF) module, comprising:

• coupling an electronic component configured for RF operation to a top side of a module substrate;
• encapsulating the electronic component in a first mold compound;
• coupling a semiconductor die to a bottom side of the module substrate;
• attaching a plurality of module contacts at the bottom side of the module substrate;
• encapsulating the semiconductor die and the plurality of module contacts in a second mold compound such that the second mold compound at least partially surrounds the semiconductor die;
• and
• removing a portion of the second mold compound to expose a surface of the semiconductor die.