US 2022/0028770 A1 · SEMICONDUCTOR DEVICE WITH A POWER CONVERTER MODULE

Abstract

A semiconductor device includes a die with a power converter module. The power converter module includes an output port and a return port. The semiconductor device also includes a connection assembly that includes pads configured to be coupled to circuit components of a printed circuit board (PCB). The connection assembly also includes a first layer patterned to include a first trace that is coupled to one of the output port and the return port and a second trace that is coupled to the other of the output port and return port. A second layer of the connection assembly is patterned to provide a first via between the first trace and a third layer and a second via between the first trace and the third layer. The third layer is patterned to provide a portion of a first conductive path and a portion of a second conductive path.

Claims20

Dependent claims

A semiconductor device comprising:

a die comprising a power converter module, wherein the power converter module includes an output port and a return port;
a connection assembly comprising:
pads configured to be coupled to circuit components of a printed circuit board (PCB);
a first layer patterned to include a first trace that is coupled to one of the output port and the return port of the power converter module and a second trace that is coupled to the other of the output port and return port of the power converter module;
a second layer patterned to provide a first via between the first trace and a third layer of the connection assembly and a second via between the first trace and the third layer of the connection assembly;
and
the third layer of the connection assembly being patterned to provide a portion of a first conductive path between the first via and a first pad of the pads and a portion of a second conductive path between the second via and a second pad of the pads.

4 more elements

A method for forming a semiconductor device, the method comprising:

forming a connection assembly with layers that includes dielectric distributed throughout the connection assembly, wherein the layers form a first electrical path between a first trace and a first pad of pads of the connection assembly and a second electrical path between a second trace and a second pad of the pads of the connection assembly;
and
mounting a die to the connection assembly, the die comprising a power converter module that includes an output port and a return port at a surface of the die, the output port being configured to be coupled to the first trace of the connection assembly, and the return port being configured to be coupled to the second trace of the connection assembly;
wherein at least one of the first electrical path and the second electrical path of the connection assembly extend in a direction normal to a surface of the die for a distance greater than a thickness of a single layer of the connection assembly.

1 more element

Dependencies are inferred from the claim text.

Semiconductor device with a power converter module

Life of this patent

Semiconductor device with a power converter module

Life of this patent

Abstract

Claims20