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US 2022/0028755 A1Published application
Semiconductor device
AssigneeAisin Corporation
InventorsTakanobu NARUSE, Hiroyoshi ARAKI
Life of this patent
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Abstract
A semiconductor device (1) includes a semiconductor module (20) and a fan device (30). The semiconductor module (20) includes a module board (21), a first element (22) mounted on the module board (21), and a second element (23a) having a smaller heat generation amount and lower heat resistance. In a flowing direction of an air flow (F) formed by driving the fan device (30), the fan device (30) is disposed downstream of the first element (22) and the second element (23a), and the first element (22) is disposed downstream of the second element (23a).
Claims6
A semiconductor device comprising:
- a semiconductor module;
- and a fan device, wherein:
- the semiconductor module includes a module board, and a first element and a second element mounted on one element mounting surface of the module board;
- the second element is an element having a smaller heat generation amount and lower heat resistance than the first element;
- and
- in a flowing direction of an air flow formed by driving the fan device, the fan device is disposed downstream of the first element and the second element, and the first element is disposed downstream of the second element.
3 more elements
Dependencies are inferred from the claim text.