Method for forming Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Windows for Thermal Transport

A method for forming a board assembly comprising:

• identifying a location of a hot-spot on a semiconductor die;
• attaching a Chemical Vapor Deposition Diamond (CVDD) window onto a surface of a thermally conductive plate, in a location corresponding to the location of the hot-spot on the semiconductor die;
• applying a layer of thermally conductive paste over the attached CVDD window;
• attaching a semiconductor die to a circuit board such that the semiconductor die is electrically coupled to the circuit board;
• and
• placing the thermally conductive plate over the semiconductor die so that the applied layer of thermally conductive paste is in contact with the semiconductor die and such that the CVDD window overlies the hot-spot.