Back to results
US 2022/0028681 A1Published application
Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method of Preparing Semiconductor Wafer
AssigneeMitsubishi Chemical Corporation
InventorsToshiaki Shibata, Yasuhiro Kawase
Life of this patent
Estimating the term…
Abstract
The present invention relates to a cleaning fluid containing components (A) to (C) and 0.001 mass % or less of a surfactant, in which component (A) is a compound represented by formula (1); component (B) is an alkaline compound; and component (C) is water, in formula (1), R1 and R2 independently represent a hydroxyl group or a phenol group.
Claims18
A cleaning fluid comprising components (A) to (C) and 0.001 mass % or less of a surfactant,
- wherein
- the component (A) is a compound represented by formula (1);
- the component (B) is an alkaline compound;
- and
- the component (C) is water;
- in formula (1),
- R1 and R2 independently represent a hydroxyl group or a phenol group.
4 more elements
A cleaning fluid comprising components (A) to (C) and no surfactant,
- wherein
- the component (A) is a compound represented by formula (1);
- the component (B) is an alkaline compound;
- and
- the component (C) is water;
- in formula (1),
- R1 and R2 independently represent a hydroxyl group or a phenol group.
4 more elements
Dependencies are inferred from the claim text.