System and method for compression dual in-line memory module scalability

An information handling system, comprising:

• a printed circuit board (PCB);
• a z-axis compression connector including an array of contact elements, wherein a first side of the z-axis compression connector is affixed to a first side of the printed circuit board;
• a dual in-line memory module (DIMM) affixed via a first surface to a second side of the z-axis compression connector, the DIMM including:
• a plurality of memory devices mounted on at least one of the first surface and a second surface of a memory circuit board of the DIMM, and arranged to be accessed via at least two memory channels, wherein the memory devices are disposed on the memory circuit board in an array of X rows and Y columns, where X and Y are integers, wherein when the DIMM has a first number of the memory devices A=X1×Y1 that is less than when the DIMM has a second number of memory devices B=X2×Y2, then either X1 is less than X2, or Y1 is less than Y2;
• and
• an array of first surface contact connections, each first surface contact connection configured to be engaged with an associated contact element of a z-axis compression connector, the array arranged to conduct signals for the memory channels, wherein the array along a major axis that is parallel to the columns.