Reciprocating rotary cvd equipment and application method

A reciprocating rotary chemical vapor deposition (CVD) apparatus, comprising:

• a cavity, a wafer heating base, and a rotating apparatus, wherein the wafer heating base is located in the cavity and a range of an angle θ by which the wafer heating base performs a reciprocating rotation is greater than 0° and less than or equal to 360°;
• a manner in which the wafer heating base performs the reciprocating rotation comprises:
• clockwise rotating by an angle θ1 from a starting position, then counterclockwise rotating by an angle θ2, and returning to the starting position through reciprocating rotation for N times, N being greater than or equal to 1;
• or counterclockwise rotating by an angle θ1 from a starting position, then clockwise rotating by an angle θ2, and returning to the starting position through reciprocating rotation for N times, N being greater than or equal to 1, and the rotational speed during the reciprocating rotation is independently controlled;
• the rotating apparatus is located outside the cavity and comprises a rotating power mechanism and a rotating sealing mechanism, and the rotating sealing mechanism comprises a rotating member and a fixed member;
• the fixed member is fixedly and hermetically connected to the cavity, the rotating member is fixedly and hermetically connected to the wafer heating base, the rotating member is movably and hermetically connected to the fixed member, and the rotating member is connected to the rotating power mechanism, to drive, by using the rotating power mechanism, the rotating member and the wafer heating base to perform reciprocating rotation;
• and the reciprocating rotary CVD apparatus further comprises a purge gas guide ring located in the cavity, a slit channel is formed between the purge gas guide ring and the wafer heating base, a range of a width W of the slit channel is greater than 0 mm and less than or equal to 1 mm, a range of a length L of the slit channel is greater than or equal to 5 mm, and a purge gas passing from the purge gas guide ring to the cavity through the rotating sealing mechanism and the slit channel is provided by using the purge gas guide ring.