Injection Molding Apparatus
AssigneeSeiko Epson Corporation
InventorDaichi MIYASHITA
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AssigneeSeiko Epson Corporation
InventorDaichi MIYASHITA
Estimating the term…
An injection molding apparatus includes: a first mounting block configured such that a fixed mold is able to be mounted thereon; a second mounting block configured such that a movable mold facing the fixed mold is able to be mounted thereon, provided with a first through hole through which a first diver is inserted, and configured to move back and forth with respect to the first mounting block along the first diver; and an injection unit configured to inject a molten material into a cavity defined by the fixed mold and the movable mold. In a state where the movable mold is mounted on the second mounting block, the second mounting block includes, between the movable mold and the first through hole, a heat conduction prevention portion configured to prevent conduction of heat from the movable mold.
An injection molding apparatus, comprising:
Dependencies are inferred from the claim text.