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US 2022/0022325 A1Published application
Barrier Layer
OwnerKunal SHAH, Purvi SHAHinventors
Life of this patent
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Abstract
A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.
Claims20
A printed circuit board (PCB), comprising:
- a plurality of copper pads;
- a barrier layer disposed on the copper pads, wherein the barrier layer includes one or more nitrogen-containing organic molecules
A printed circuit board (PCB) comprising:
- a copper layer including:
- a top portion having a plurality of copper grains each separated by passivated grain boundaries, wherein each of the passivated grain boundaries comprises one or more nitrogen-containing organic molecules;
- and
- a bottom portion having a plurality of copper grains each separated by non-passivated grain boundaries.
1 more element
A printed circuit board (PCB) comprising:
- a copper layer including a top portion positioned above a bottom portion, wherein the top portion includes a plurality of passivated grain boundaries that each include one or more nitrogen-containing organic molecules, and wherein the bottom portion includes a plurality of non-passivated grain boundaries.
Dependencies are inferred from the claim text.