Substrate with electronic component embedded therein

A substrate with an electronic component embedded therein, comprising:

• a core structure including an insulating body, a plurality of wiring layers respectively disposed on or in the insulating body, and one or more via layers disposed in the insulating body, the core structure having a cavity penetrating through at least a portion of the insulating body;
• a metal layer disposed on a bottom surface of the cavity, and having a pattern hole;
• and
• an electronic component disposed on the metal layer in the cavity.

A substrate, comprising:

• a core structure having a cavity and including an insulating body, one or more first wiring layers disposed on or in the insulating body, and one or more via layers disposed in the insulating body and connected to the one or more first wiring layers;
• a first metal layer disposed on or in the insulating layer;
• an electronic component disposed on the first metal layer in the cavity;
• and
• a second metal layer extending from the first metal layer to be in contact with a side surface of the electronic component.