Heatsinks for an image capture device

An image capture device, comprising:

• a heatsink comprising a cutout that is generally centered, a first side, and a second side, the heatsink configured to absorb thermal energy and block electromagnetic signals, the first side having first and second portions located adjacent to the cutout;
• a sensor positioned adjacent to the first portion of the first side of the heatsink and configured to generate thermal energy;
• a liquid-crystal display in contact with or adjacent to the second side of the heatsink, the liquid-crystal display configured to generate electromagnetic signals;
• and
• a circuit extending from the second side, through the cutout, to the second portion of the first side so the circuit is free of contact with the first portion of the first side, the circuit configured to amplify electromagnetic signals.

An image capture device, comprising:

• a printed circuit board having parallel first and second surfaces that are separated by a top edge;
• a component disposed on the first surface of the printed circuit board and configured to generate thermal energy;
• a heatsink positioned adjacent to the second surface of the printed circuit board and configured to absorb thermal energy;
• and
• a conductor that extends from the component, across the first surface, over the top edge, and to the heatsink.