Optoelectronic semiconductor component having a current distribution layer and method for producing the optoelectronic semiconductor component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMartin BEHRINGER, Alexander BEHRES, Matin MOHAJERANI
Life of this patent
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Abstract
An optoelectronic semiconductor component has a first semiconductor layer of a p-conductivity type, a second semiconductor layer of an n-conductivity type and also an n-doped current distribution layer containing ZnSe and adjoining the second semiconductor layer.
Claims20
An optoelectronic semiconductor component comprising:
- a first semiconductor layer of a p-conductivity type;
- a second semiconductor layer of an n-conductivity type;
- an n-doped current spreading layer which contains ZnSe and is directly adjacent to the second semiconductor layer;
- and
- a transparent substrate which is located on a side of the n-doped current spreading layer facing away from the second semiconductor layer.
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A method for producing an optoelectronic semiconductor component, comprising:
- forming a first semiconductor layer of a p-conductivity type,
- thereafter, forming a second semiconductor layer of an n-conductivity type, wherein the first semiconductor layer and the second semiconductor layer are formed over a growth substrate,
- forming an n-doped current spreading layer which contains ZnSe and is directly adjacent to the second semiconductor layer, thereby obtaining a workpiece, and
- rebonding the workpiece onto a transparent substrate, so that the transparent substrate is arranged on a side of the current spreading layer facing away from the second semiconductor layer.
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A method for producing an optoelectronic semiconductor component, comprising:
- forming a second semiconductor layer of an n-conductivity type over a growth substrate,
- thereafter, forming a first semiconductor layer of a p-conductivity type, thereby obtaining a workpiece,
- rebonding the workpiece onto a working substrate, so that the first semiconductor layer is arranged on the side of the working substrate,
- thereafter, forming an n-doped current spreading layer which contains ZnSe and is directly adjacent to the second semiconductor layer, and
- rebonding the workpiece onto a transparent substrate after forming the current spreading layer so that the transparent substrate is arranged on a side of the current spreading layer facing away from the second semiconductor layer.
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Dependencies are inferred from the claim text.