Photonic Integrated Circuits with Controlled Collapse Chip Connections

A method of manufacturing an optical device, the method comprising:

• forming a trench in a first substrate, the trench defining a depression along a surface of the first substrate;
• forming a raised feature around the trench, the raised feature comprising a second substrate extending from the surface;
• coupling a laser die to the first substrate such that the laser die is positioned within the trench and surrounded by the raised feature;
• introducing a first optical material to a first region between the raised feature and the laser die;
• coupling a third substrate to the raised feature such that the raised feature is positioned between the first substrate and the third substrate;
• and
• introducing a second material to a second region at least partially defined by the first substrate, the raised feature, and the third substrate.

An optical device, comprising:

• a first substrate defining:
• a surface comprising a first electrical contact;
• and
• a trench forming a depression along a portion of the surface;
• a laser die positioned within the trench and interconnected with the first electrical contact;
• a first material coupled with the laser die and at least a portion of the first substrate;
• a second substrate coupled to the first substrate and forming a cavity around the laser die, the second substrate comprising a second electrical contact that is electrically coupled to the first electrical contact;
• and
• an electrical interconnect coupled to an outer surface of the second substrate and electrically coupled with the second electrical contact.

A method of forming an optical device, the method comprising:

• forming a trench in a first substrate, the trench defining a depression along a surface of the first substrate;
• depositing a first electrical contact onto the first substrate such that a first portion of the first electrical contact is located in the trench;
• coupling a laser die to the first substrate such that the laser die is positioned within the trench;
• applying a first material over the laser die and at least a portion of the first substrate;
• coupling a second substrate to the first substrate such that a second electrical contact of the second substrate is electrically coupled with the first electrical contact, the second substrate forming a cavity around the laser die;
• and
• forming an electrical interconnect on an outer surface of the second substrate such that the electrical interconnect is electrically coupled to the second electrical contact.