Oled automatic production equipment
AssigneeShenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorKeyuan Wang
Life of this patent
Estimating the term…
Abstract
An organic light emitting diode (OLED) automatic production equipment is provided. The OLED automatic production equipment includes a vapor deposition device, a printing device, a sputtering device, a flexible packaging device, and a thin film packaging device. The thin film packaging device is in communication with the vapor deposition device, the printing device, the sputtering device, the flexible packaging device, and the like. Processors of the vapor deposition device, the printing device, the sputtering device, and the flexible packaging device are configured to perform two-way communication with a processor of the thin film packaging device.
Claims18
An organic light emitting diode (OLED) automatic production equipment, comprising:
- a vapor deposition device configured to transfer a glass substrate and comprising a processor;
- a printing device configured to transfer the glass substrate and comprising a processor;
- a sputtering device configured to transfer the glass substrate and comprising a processor;
- a flexible packaging device configured to transfer the glass substrate and comprising a processor;
- and
- a thin film packaging device configured to transfer the glass substrate and comprising a processor, wherein the thin film packaging device is in communication with the vapor deposition device, the printing device, the sputtering device, and the flexible packaging device;
- wherein the processor of the vapor deposition device is configured to perform two-way communication with the processor of the thin film packaging device, and when the processor of the vapor deposition device and the processor of the thin film packaging device perform two-way communication, the vapor deposition device transfers the glass substrate to the thin film packaging device, the vapor deposition device receives the glass substrate from the thin film packaging device, and the processor of the vapor deposition device and the processor of the thin film packaging device perform two-way communication of glass substrate transmitting message;
- wherein the processor of the vapor deposition device is configured to process tape-out standards and specifications of the vapor deposition device, such that the two-way communication of the glass substrate transmitting message and transmission of the glass substrate on the vapor deposition device match each other;
- wherein the processor of the thin film packaging device is configured to process tape-out standards and specifications of the thin film packaging device, such that the two-way communication of the glass substrate transmitting message and transmission of the glass substrate on the thin film packaging device match each other.
An OLED automatic production equipment, comprising:
- a vapor deposition device configured to transfer a glass substrate and comprising a processor;
- a printing device configured to transfer the glass substrate and comprising a processor;
- a sputtering device configured to transfer the glass substrate and comprising a processor;
- a flexible packaging device configured to transfer the glass substrate and comprising a processor;
- and
- a thin film packaging device configured to transfer the glass substrate and comprising a processor, wherein the thin film packaging device is in communication with the vapor deposition device, the printing device, the sputtering device, and the flexible packaging device;
- wherein the processor of the vapor deposition device is configured to perform two-way communication with the processor of the thin film packaging device, and when the processor of the vapor deposition device and the processor of the thin film packaging device perform two-way communication, the vapor deposition device transfers the glass substrate to the thin film packaging device, the vapor deposition device receives the glass substrate from the thin film packaging device, and the processor of the vapor deposition device and the processor of the thin film packaging device perform two-way communication of glass substrate transmitting message.
Dependencies are inferred from the claim text.