Method for defining a gap height within an image sensor package
AssigneeSemiconductor Components Industries, LLC
InventorYu-Te HSIEH
Life of this patent
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Abstract
According to an aspect, a method for fabricating an image sensor package to define a gap height includes coupling an image sensor die to a substrate, forming a plurality of pillar members on the image sensor die, dispensing a bonding material on the image sensor die, contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member, and curing the bonding material to couple the transparent member to the image sensor die.
Claims20
A method for fabricating an image sensor package to define a gap height, the method comprising:
- coupling an image sensor die to a substrate;
- forming a plurality of pillar members on the image sensor die;
- dispensing a bonding material on the image sensor die;
- contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member;
- and
- curing the bonding material to couple the transparent member to the image sensor die.
A method for fabricating an image sensor package to define a gap height, the method comprising:
- coupling an image sensor die to a substrate;
- coupling bond wires to the image sensor die and to the substrate;
- forming a plurality of pillar members on a mount area of the image sensor die, the mount area being disposed outside an active region of the image sensor die;
- dispensing a bonding material on the mount area of the image sensor die;
- contacting a transparent member with the bonding material such that a height of the plurality of pillar members defines a gap height between the active region of the image sensor die and the transparent member;
- and
- curing the bonding material to couple the transparent member to the image sensor die.
A method for fabricating an image sensor package to define a gap height, the method comprising:
- dispensing a bonding material on a mount area of an image sensor die, the image sensor die being coupled to a substrate;
- coupling a transparent member to a bond head;
- moving the bond head to a programmable position to place the transparent member in contact with the bonding material, the programmable position defining a gap height between an active region of the image sensor die and the transparent member;
- curing the bonding material to couple the transparent member to the image sensor die while the bond head is coupled to the transparent member;
- and
- releasing the bond head from the transparent member.
Dependencies are inferred from the claim text.