Methods of forming an apparatus including laminate spacer structures

A method of forming an apparatus, comprising:

• forming a first dielectric structure within an opening at least partially extending through one or more conductive materials;
• forming a second dielectric structure doped with one or more of H, He, and Ne on surfaces of the first dielectric structure within the opening;
• forming a third dielectric structure on exposed surfaces of the second dielectric structure within the opening to form a laminate spacer structure comprising the first dielectric structure, the second dielectric structure, and the third dielectric structure;
• and
• heating the laminate spacer structure to effectuate migration of the one or more of H, He, and Ne within the second dielectric structure thereof and form gas pockets dispersed within dielectric material of the second dielectric structure.

A method of forming an apparatus, comprising:

• forming a first dielectric spacer material on surfaces within and beyond boundaries of an opening extending through one or more conductive materials;
• forming a second dielectric spacer material on surfaces of the first dielectric spacer material;
• doping the second dielectric spacer material with one or more of H, He, and Ne to form a doped second dielectric spacer material;
• removing portions of the first dielectric spacer material and the doped second dielectric spacer material to respectively form a first dielectric spacer structure and a second dielectric spacer structure substantially confined within the boundaries of the opening;
• forming a third dielectric spacer material on surfaces of the first dielectric spacer structure and the second dielectric spacer structure;
• removing portions of the third dielectric spacer material to form a laminate spacer structure comprising the first dielectric spacer structure, the second dielectric spacer structure, and a third dielectric spacer structure comprising a remaining portion of the third dielectric spacer material;
• partially filling a remaining portion of the opening with a conductive material after forming the laminate spacer structure;
• forming a dielectric liner covering exposed surfaces of the laminate spacer structure after partially filling the remaining portion of the opening with the conductive material;
• and
• heating the laminate spacer structure, after forming the dielectric liner, to form gas pockets dispersed within the second dielectric spacer structure of the laminate spacer structure.