Semiconductor device and method of manufacturing semiconductor device

A semiconductor device, comprising:

• a semiconductor chip having a first metal bump in a central region and a second metal bump in an outer peripheral region outside central region when viewed in a plan view;
• and
• an interconnection substrate having a first pad connected to the first metal bump and a second pad connected to the second metal bump, wherein
• a first compound layer comprising a material of the first metal bump and a material of the first pad is between the first metal bump and the first pad,
• a second compound layer comprising a material of a second metal bump and a material of the second pad is between the second metal bump and the second pad, and
• a thickness of the first compound layer and a thickness of the second compound layer are different from each other.

A method of manufacturing a semiconductor device, the method comprising:

• forming a plurality of metal bump on a first surface side of a semiconductor chip;
• positioning the semiconductor chip so the plurality of metal bumps roughly correspond in planar position to a plurality of pads of an interconnection substrate;
• bringing at least some of the metal bumps into contact with corresponding ones of the pads;
• applying a first light from a second surface side of the semiconductor chip and melting at least some of the metal bumps with the first light;
• allowing the melted metal bumps to resolidify by stopping or reducing the application of the first light;
• pressing the semiconductor chip toward the interconnection substrate after the stopping or reducing of the application of the first light to additionally cause one or more metal bumps to come in contact with a corresponding one of the pads;
• applying a second light from the second surface side of the semiconductor chip while pressing the semiconductor chip toward the interconnection substrate to melt at least some of the metal bumps;
• and
• allowing the melted metal bumps to resolidify by stopping or reducing the application of the second light.