Eccentric Via Structures for Stress Reduction

A structure comprising:

• a first dielectric layer;
• a first via extending into the first dielectric layer;
• a conductive trace over the first dielectric layer, wherein the conductive trace is over and joined to the first via;
• a second dielectric layer covering the conductive trace;
• a second via in the second dielectric layer;
• a conductive pad over and contacting the second via;
• and
• a conductive bump over and contacting the conductive pad, wherein the conductive pad extends laterally beyond edges of the conductive bump, and wherein the second via and the conductive bump are eccentric.

A structure comprising:

• a plurality of dielectric layers;
• a plurality of redistribution lines in the plurality of dielectric layers, wherein each of the plurality of redistribution lines comprises a via and a trace over and contacting the via, and the vias in the plurality of redistribution lines are stacked to form a via stack, with the vias being vertically aligned;
• a top via over and contacting a top trace in a top redistribution line of the plurality of redistribution lines;
• a conductive pad over and contacting the top via;
• and
• a conductive bump over and joined to the conductive pad, wherein the conductive pad and the conductive bump share a common center line, and the top via is offset from the common center line, with at least a portion of the top via being overlapped by the conductive bump.