US 2022/0020615 A1 · MULTIPLE PROCESS SEMICONDUCTOR PROCESSING SYSTEM

Abstract

Exemplary substrate processing systems may include a plurality of processing regions. The systems may include a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions. The systems may include a plurality of substrate supports. Each substrate support of the plurality of substrate supports may be vertically translatable between the transfer region and an associated processing region of the plurality of processing regions. The systems may include a transfer apparatus including a rotatable shaft extending through the transfer region housing. The transfer apparatus may also include an end effector coupled with the rotatable shaft. The systems may include an exhaust foreline including a plurality of foreline tails. Each foreline tail of the plurality of foreline tails may be fluidly coupled with a separate processing region of the plurality of processing regions. The systems may include a plurality of throttle valves.

Claims20

Dependent claims

A substrate processing system comprising:

a plurality of processing regions;
a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions;
a plurality of substrate supports, each substrate support of the plurality of substrate supports vertically translatable between the transfer region and an associated processing region of the plurality of processing regions;
a transfer apparatus comprising:
a rotatable shaft extending through the transfer region housing, and
an end effector coupled with the rotatable shaft;
an exhaust foreline including a plurality of foreline tails, each foreline tail of the plurality of foreline tails fluidly coupling with a separate processing region of the plurality of processing regions;
and
a plurality of throttle valves, wherein a throttle valve of the plurality of throttle valves is incorporated in each foreline tail of the plurality of foreline tails.

6 more elements

A method of semiconductor processing comprising:

delivering one or more processing precursors through a plurality of lid stacks of a substrate processing system, each lid stack of the plurality of lid stacks fluidly accessing a processing region of a plurality of processing regions, wherein each processing region of the plurality of processing regions is at least partially defined by a lid stack of the plurality of lid stacks and a substrate support of a plurality of substrate supports;
forming a pressure differential between two processing regions of the plurality of processing regions;
delivering a purge gas into a transfer region of the substrate processing system through a plurality of purge channels extending through a transfer region housing defining the transfer region, wherein the transfer region is fluidly coupled with each processing region of the plurality of processing regions;
and
exhausting the processing precursors and the purge gas through a pumping liner of each lid stack of the plurality of lid stacks.

2 more elements

Dependencies are inferred from the claim text.

Multiple process semiconductor processing system

Life of this patent

Multiple process semiconductor processing system

Life of this patent

Abstract

Claims20