Substrate cleaning device and substrate cleaning method

A substrate cleaning device comprising:

• a cleaning member configured to clean a substrate by contacting the substrate;
• a member rotation unit configured to rotate the cleaning member;
• a member drive unit configured to press the cleaning member against the substrate;
• a load measurement unit configured to measure a measurement value of an applied pressing load of the cleaning member;
• and
• a control unit configured to control an applied pressing amount of the cleaning member by the member drive unit, on the basis of the measurement value of the load measurement unit, so that the applied pressing load of the cleaning member becomes a setting load, wherein
• the control unit stores a correspondence relation between pressing loads and pressing amounts of the cleaning member for M different stored pressing loads as master data,
• the control unit acquires the correspondence relation between the pressing loads and the pressing amounts of the cleaning member for N different pressing loads among the M different stored pressing loads as measurement data, on the basis of the measurement value of the load measurement unit,
• the control unit corrects each of the pressing amounts corresponding to the M different stored pressing loads in the master data, on the basis of the measurement data, so that the correspondence relation between the pressing loads and the pressing amounts for the N different pressing loads in the master data approaches the correspondence relation between the pressing loads and the pressing amounts for the N different pressing loads in the measurement data, and generates data for a movement amount calculation showing the correspondence relation between the pressing loads and the pressing amounts for the M different stored pressing loads, and
• the control unit calculates the calculated pressing amount of the cleaning member corresponding to the setting load, on the basis of the correspondence relation between the pressing loads and the pressing amounts in the data for movement amount calculation.

A substrate cleaning device comprising:

• a first cleaning member configured to clean a first surface of a substrate by contacting the first surface of the substrate;
• a first member rotation unit configured to rotate the first cleaning member;
• a first member drive unit configured to press the first cleaning member against the first surface of the substrate;
• a first load measurement unit configured to measure a pressing load of the first cleaning member;
• a second cleaning member configured to clean a second surface of the substrate by contacting the second surface of the substrate;
• a second member rotation unit configured to rotate the second cleaning member;
• a second member drive unit configured to press the second cleaning member against the second surface of the substrate;
• a second load measurement unit configured to measure a pressing load of the second cleaning member;
• and
• a control unit configured to control a pressing amount of the first cleaning member by the first member drive unit and a pressing amount of the second cleaning member by the second member drive unit, on the basis of a measurement value of the first load measurement unit and a measurement value of the second load measurement unit, so that the pressing load of the first cleaning member becomes a first setting load and the pressing load of the second cleaning member becomes a second setting load, wherein
• the control unit is configured to execute
• a first step of controlling the first member drive unit and the second member drive unit so that the first cleaning member moves at a first movement speed from a first initial position separated from the first surface of the substrate by a first distance to a first proximity position separated from the first surface of the substrate by a third distance and the second cleaning member moves at a second movement speed from a second initial position separated from the second surface of the substrate by a second distance shorter than the first distance to a second proximity position separated from the second surface of the substrate by the third distance and
• a second step of controlling the first member drive unit and the second member drive unit so that the first cleaning member and the second cleaning member simultaneously start moving at a third movement speed lower than the first movement speed and simultaneously contact the first surface of the substrate and the second surface of the substrate, respectively, and
• the control unit is configured to determine, before the first step, the second movement speed of the second cleaning member by the second member drive unit, on the basis of the first movement speed of the first cleaning member by the first member drive unit, so that the first cleaning member disposed at the first initial position and the second cleaning member disposed at the second initial position simultaneously start the moving and the second cleaning member reaches the second proximity position at timing identical to timing when the first cleaning member reaches the first proximity position.