Direct chip-on-array for a multidimensional transducer array

An ultrasound transducer probe comprising:

• a chip-on-array arrangement of a semiconductor chip electrically connected to a multi-dimensional transducer array, the multi-dimensional transducer array comprising a quarter wavelength transducer with a dematching layer, the semiconductor chip electrically connected to the multi-dimensional transducer array through the dematching layer;
• and
• contact pads formed on the dematching layer for ground and signaling from the semiconductor chip to an ultrasound imaging system, the dematching layer providing signal routing from the contact pads to the semiconductor chip and from the semiconductor chip to the multi-dimensional transduce array.

A method for connecting electronics with an array of acoustic elements, the method comprising:

• connecting an integrated circuit directly to a first surface of a dematching layer of the acoustic elements;
• and
• connecting conductors to a second surface of the dematching layer, the second surface opposite the first surface, the conductors connected to pads on the second surface outside of a footprint on the dematching layer of the acoustic elements.