US 2022/0018897 A1 · SEMICONDUCTOR MODULE INSPECTION DEVICE WITH ROBOT

Abstract

A semiconductor module inspection device is provided. The semiconductor module inspection device includes a receiver to store semiconductor modules; a loader to receive a semiconductor module from the receiver; a testing unit to receive the semiconductor module from the loader and perform a test process on the semiconductor module; an unloader to receive the semiconductor module from the testing unit and provide the semiconductor module from the testing unit to the receiver; and robots for transporting the semiconductor module. The robots include: a first robot to transport the semiconductor module from the receiver to the loader, a second robot to transport the semiconductor module from the loader to the testing unit, a third robot to transport the semiconductor module from the testing unit to the unloader, and a fourth robot to transport the semiconductor module from the unloader to the receiver.

Claims20

Dependent claims

A semiconductor module inspection device comprising:

a receiver configured to store a plurality of semiconductor modules;
a loader configured to receive a semiconductor module, from among the plurality of semiconductor modules, from the receiver;
a testing unit configured to receive the semiconductor module from the loader, and perform a test process on the semiconductor module;
an unloader configured to receive the semiconductor module from the testing unit, and provide the semiconductor module from the testing unit to the receiver;
and
a plurality of robots for transporting the semiconductor module,
wherein the plurality of robots comprises:
a first robot configured to transport the semiconductor module from the receiver to the loader,
a second robot configured to transport the semiconductor module from the loader to the testing unit,
a third robot configured to transport the semiconductor module from the testing unit to the unloader, and
a fourth robot configured to transport the semiconductor module from the unloader to the receiver.

8 more elements

A semiconductor module inspection device comprising:

a first stacker configured to receive a semiconductor module and stack the semiconductor module on other semiconductor modules;
a loader configured to receive the semiconductor module from the first stacker;
a first chamber configured to maintain an internal temperature thereof at a predetermined temperature;
a second chamber configured to perform an electrical test process on the semiconductor module at the predetermined temperature;
and
a robot configured to move the semiconductor module from the loader to the first chamber,
wherein the predetermined temperature is between 70° C. and 130° C. or between −60° C. and −20° C.

4 more elements

A semiconductor module inspection device comprising:

a first stacker configured to receive a semiconductor module therein;
a loader configured to receive the semiconductor module from the first stacker;
a first chamber configured to receive the semiconductor module from the loader, the first chamber being configured to maintain an internal temperature thereof at a predetermined temperature;
a second chamber comprising a tester configured to send and receive electrical signals to and from the semiconductor module, the second chamber being configured to perform a test process on the semiconductor module at the predetermined temperature;
a third chamber configured to maintain a temperature between the predetermined temperature and a normal temperature;
a first tray configured to move between the first chamber and the second chamber;
a second tray configured to move between the second chamber and the third chamber;
an unloader configured to receive the semiconductor module from the third chamber;
a second stacker configured to receive the semiconductor module;
a third stacker for receiving configured to receive the semiconductor module;
a first robot configured to transport the semiconductor module from the first stacker to the loader;
a second robot configured to transport the semiconductor module from the loader to the first chamber;
a third robot configured to transport the semiconductor module from the first tray and insert the semiconductor module into the tester;
a fourth robot configured to transport the semiconductor module from the third chamber to the unloader;
and
a fifth robot configured to transport the semiconductor module from the unloader to the second stacker or the third stacker,
wherein the fifth robot is configured to place the semiconductor module on the second stacker based on the semiconductor module satisfying predetermined reference values in the test process, and place the semiconductor module on the third stacker based on the semiconductor module not satisfying one of the predetermined reference values in the test process.

14 more elements

Dependencies are inferred from the claim text.

Semiconductor module inspection device with robot

Life of this patent

Semiconductor module inspection device with robot

Life of this patent

Abstract

Claims20