Method and apparatus for testing printed circuit boards

Abstract

A method for testing printed circuit boards (20) in a test apparatus having a carrying apparatus for the printed circuit board (20) and having test modules for measuring physical variables of components (EB) and contact points (29) on the printed circuit board (20), in which the width of the printed circuit board (20) defines an X direction, its length defines a Y direction and its thickness defines a Z direction inside the test apparatus, reference points, the X, Y and Z positions of which relative to the carrying apparatus are known, are present on the printed circuit board (20) or outside the latter, the X and Y positions of the components (EB) and contact points (29) relative to the reference points are known, the measurement of the physical variables depends on an actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured, and the actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured is determined by means of an interpolation method starting from the X, Y and Z positions of selected reference points.

Dependencies are inferred from the claim text.