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US 2022/0017783 A1Published application
Polishing liquid, polishing liquid set, and polishing method
AssigneeShowa Denko Materials Co., Ltd.
InventorsTomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA
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Abstract
A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.
Claims20
A polishing liquid comprising:
- abrasive grains;
- a hydroxy acid component including a hydroxy acid including a hydroxyl group and a carboxyl group, the hydroxyl group not forming part of the carboxyl group;
- a polyol component;
- a cationic component comprising a cationic compound;
- and a liquid medium, wherein
- the abrasive grains comprise more than 50% by mass of ceria based on the total mass of the abrasive grains,
- a zeta potential of the abrasive grains is positive, and
- a weight average molecular weight of the cationic component is less than 1000.
5 more elements
Dependencies are inferred from the claim text.