Silicon wafer polishing composition and method

A method of chemical mechanical polishing a wafer, the method comprising:

• (a) contacting the wafer with a polishing composition comprising
• (i) an aqueous based liquid carrier;
• (ii) abrasive particles dispersed in the liquid carrier;
• (iii) about 0.01 weight percent to about 2 weight percent of a dipolar aprotic solvent;
• and (iv) a pH in a range from about 8 to about 12;
• (b) moving the polishing composition relative to the wafer;
• and
• (c) abrading the wafer to remove silicon from the wafer and thereby polish the wafer.

A method of polishing a silicon wafer, the method comprising:

• (a) providing a polishing apparatus having at least one polishing pad mounted on a corresponding platen;
• (b) contacting the polishing pad with a dipolar aprotic solvent to wet the polishing pad;
• (c) contacting said wetted polishing pad with a polishing composition;
• (d) moving the polishing composition relative to the wafer;
• and
• (e) abrading the wafer to remove silicon from the wafer and thereby polish the wafer.