US 2022/0017693 A1 · Encapsulating Composition

Abstract

The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method, can provide a thin display and can effectively prevent interference of an electromagnetic field due to a low dielectric constant.

Claims22

Dependent claims

An encapsulating composition comprising an epoxy compound and an oxetane compound, wherein the epoxy compound comprises a linear monofunctional epoxy compound having 7 or more carbon atoms, and

the linear monofunctional epoxy compound is included in a range of 25 to 81 parts by weight relative to 100 parts by weight of the total epoxy compound in the encapsulating composition.

Dependencies are inferred from the claim text.

Facts

Application

17/278,116Filed 30 Sep 2019

Priority

KR 10-2018-011596828 Sep 2018

Published

20 Jan 2022

Term ends

Not estimatedThe source records don’t support an estimate.

Classification16 codes

C08G 59/223
Di-epoxy compounds: together with monoepoxy compounds
C08G 65/18
Cyclic ethers having four or more ring atoms: oxetanes
C08G 65/22
From cyclic ethers only: cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
C09D 7/45
Additives: anti-settling agents

Encapsulating Composition

Life of this patent

Encapsulating Composition

Life of this patent

Abstract

Claims22