Planar resistive random-access memory (rram) device with a shared top electrode
AssigneeInternational Business Machines Corporation
InventorsAshim Dutta, Saumya Sharma, Tianji Zhou, Chih-Chao Yang
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AssigneeInternational Business Machines Corporation
InventorsAshim Dutta, Saumya Sharma, Tianji Zhou, Chih-Chao Yang
Estimating the term…
Embodiments of the present invention are directed to forming a planar Resistive Random Access Memory (RRAM) device with a shared top electrode. In a non-limiting embodiment of the invention, a first trench having a first width and a second trench having a second width less than the first width are formed in a dielectric layer. A bottom liner is formed on sidewalls of the first trench. The bottom liner pinches off the second trench. A top liner is formed on sidewalls of the bottom liner in the first trench. The top liner is formed such that a portion of the bottom liner at a bottommost region of the first trench remains exposed. The exposed portion of the bottom liner is removed, and a memory cell material is formed in the first trench.
A method for forming a semiconductor device, the method comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.