Solid-state imaging device, manufacturing method thereof, and electronic apparatus

A solid-state imaging device comprising:

• a lens;
• a first semiconductor chip including a first substrate and a first multilayer wiring layer, the first multilayer wiring layer including a first arrangement of a first plurality of electrically conductive components respectively having a first width and a first interval between instances of the first plurality of electrically conductive components, the lens being formed above the first arrangement of the first plurality of electrically conductive components;
• and
• a second semiconductor chip including a second substrate and a second multilayer wiring layer, the second multilayer wiring layer including a second arrangement of a second plurality of electrically conductive components respectively having a second width and a second interval between instances of the second plurality of electrically conductive components, the first width being smaller than the second width, and the first interval being greater than the second interval, wherein
• the first semiconductor chip and the second semiconductor chip are bonded such that the first multilayer wiring layer and the second multilayer wiring layer face each other, and
• the first arrangement of the first plurality of electrically conductive components and the second arrangement of the second plurality of electrically conductive components are directly bonded.