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US 2022/0013565 A1Published application
3d image sensor
AssigneeDB HiTek Co., Ltd.
InventorMan-Lyun HA
Life of this patent
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Abstract
A 3D image sensor is disclosed. More particularly, an image sensor in which all constituents, including a photoelectric conversion element and constituents for image data output, are in a three-dimensional stack, thereby improving the degree of integration and freedom of a corresponding layout, and resolving the difference in time response when reading pixel data for each row.
Claims18
A 3D image sensor comprising:
- a first semiconductor chip including unit pixels in a two-dimensional (2D) array;
- a second semiconductor chip on the first semiconductor chip, and electrically connected to the first semiconductor chip;
- and
- a third semiconductor chip on the second semiconductor chip, and electrically connected to the second semiconductor chip,
- wherein the first, second and third semiconductor chips are in a stack,
- the first semiconductor chip comprises a first substrate having a pixel area, a plurality of unit pixels in a 2D array on and/or in the first substrate in a pixel area, and each of the plurality of unit pixels includes a photoelectric conversion element,
- the second semiconductor chip comprises a second substrate having a driving element area and a plurality of driving elements in a 2D array on and/or in the second substrate in the driving element area, and
- the third semiconductor chip comprises a third substrate having a logic area and a plurality of analog-digital converters (ADCs) in a 2D structure on and/or in the third substrate in the logic area.
5 more elements
A 3D image sensor comprising:
- a first semiconductor chip including unit pixels in a two-dimensional (2D) array in a pixel area;
- a second semiconductor chip including driving elements in a 2D array in a driving element area, the second semiconductor chip being on the first semiconductor chip;
- and
- a third semiconductor chip including a plurality of ADCs in a 2D array in a logic area, the third semiconductor chip being on the second semiconductor chip,
- wherein the first, second and third semiconductor chips are in a stack, and
- each of the plurality of unit pixels and respective ones of the plurality of ADCs correspond in a 1:1 relationship in a z-axis or chip stacking direction.
3 more elements
A 3D image sensor comprising:
- a first semiconductor chip including unit pixels in a two-dimensional (2D) array in a pixel area;
- a second semiconductor chip including unit driving elements in a 2D array in a driving element area overlapping the pixel area, the unit driving elements corresponding with the unit pixels in a 1:1 relationship, the second semiconductor chip being on the first semiconductor chip;
- and
- a third semiconductor chip including a plurality of analog-digital converters (ADCs) in a 2D array in a logic area overlapping the pixel area, the plurality of ADCs corresponding with the unit pixels in a 1:1 relationship, and the third semiconductor chip being on the second semiconductor chip;
- wherein the first, second and third semiconductor chips are in a stack.
2 more elements
Dependencies are inferred from the claim text.