US 2022/0013522 A1 · SEMICONDUCTOR DEVICE IMPLEMENTED WITH BURIED RAILS

Abstract

Certain aspects of the present disclosure generally relate to a semiconductor device with buried rails (e.g., buried power and ground rails). One example semiconductor device generally includes a substrate; a first rail, wherein a portion of the first rail is disposed in the substrate, the portion of the first rail having a first width greater than a second width of another portion of the first rail; a second rail, wherein a portion of the second rail is disposed in the substrate, the portion of the second rail having a third width greater than a fourth width of another portion of the second rail; and one or more transistors disposed above the substrate and between the first rail and the second rail.

Claims20

Dependent claims

A semiconductor device, comprising:

a substrate;
a first rail, wherein a portion of the first rail is disposed in the substrate, the portion of the first rail having a first width greater than a second width of another portion of the first rail wherein the portion of the first rail has an oval shape;
a second rail, wherein a portion of the second rail is disposed in the substrate, the portion of the second rail having a third width greater than a fourth width of another portion of the second rail;
and
one or more transistors disposed above the substrate and between the first rail and the second rail, wherein an axis defines a transition from the portion of the first rail having the oval shape to the other portion of the first rail, the axis being aligned with a bottom of a fin of the one or more transistors.

2 more elements

Dependencies are inferred from the claim text.

Semiconductor device implemented with buried rails

Life of this patent

Semiconductor device implemented with buried rails

Life of this patent

Abstract

Claims20