Interposer-Less Multi-Chip Module
AssigneeInternational Business Machines Corporation
InventorEffendi Leobandung
Life of this patent
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Abstract
Interposer-less multi-chip module are provided. In one aspect, an interposer-less multi-chip module includes: a substrate; a base film disposed on the substrate; and chips pressed into the base film, wherein top surfaces of the chips are coplanar. For instance, the chips can have varying thicknesses and are pressed into the base film to different depths such that top surfaces of the chips are coplanar. An interconnect layer having back-end-of line (BEOL) metal wiring can be present on the wafer over the chips. Methods of forming an interposer-less multi-chip module are also provided.
Claims24
An interposer-less multi-chip module, comprising:
- a substrate;
- a base film disposed on the substrate;
- and
- chips pressed into the base film, wherein top surfaces of the chips are coplanar.
An interposer-less multi-chip module, comprising:
- a substrate;
- a base film disposed on the substrate;
- chips pressed into the base film, wherein the chips have varying thicknesses, and wherein the chips are pressed into the base film to different depths such that top surfaces of the chips are coplanar;
- and
- an interconnect layer present on the wafer over the chips, wherein the interconnect layer comprises back-end-of line (BEOL) metal wiring.
A method of forming an interposer-less multi-chip module, the method comprising:
- depositing a base film onto a substrate;
- placing chips on the substrate over the base film;
- pressing the chips into the base film using a presser such that top surfaces of the chips are coplanar;
- and
- curing the base film to cross-link the base film.
A method of forming an interposer-less multi-chip module, the method comprising:
- depositing a base film onto a substrate;
- placing chips on the substrate over the base film, wherein the chips have varying thicknesses;
- pressing the chips into the base film using a presser, wherein the presser presses the chips having the varying thickness into the base film to different depths such that top surfaces of the chips are coplanar;
- curing the base film;
- and
- forming an interconnect layer on the wafer over the chips, wherein the interconnect layer comprises BEOL metal wiring.
Dependencies are inferred from the claim text.